Microsoft is just one of many major tech companies to help establish a universal chiplet standard. AMD, Advanced Semiconductor Engineer, Arm, Google Cloud, Intel, Meta, Microsoft, Qualcomm, Samsung, and Taiwan Semiconductor Manufacturing Company (TSMC) recently formed a consortium to create the standard known as UCIe 1.0 (via ZDNet). UCIe is short for Universal Chiplet Interconnect Express.
Unlike USB, PCIe, and NVMe, which all have universal standards, chiplets are not standardized. Companies use proprietary interconnects that can limit which components can be used together. In other words, chiplets and related parts are not plug-and-play right now. Having a universal standard for chiplets should help companies and consumers.
The consortium has not outlined a specific timeframe for the standard to be widely implemented. A press release on the topic provides a general sense that the implementation could be sooner rather than later. Upon incorporation of the new UCIe industry organization this year, member companies will begin work on the next generation of UCIe technology, including defining the chiplet form factor, management, enhanced security, and other essential protocols.